MYPro I50X

MYPro I50X

Automated Optical Inspection (AOI) Equipment by Mycronic AB (5 more products)

Note: Your request will be directed to Mycronic AB

The MYPro I50X from Mycronic AB is a 3D Automated Optical Inspection (AOI) Equipment. It is designed for PCB dimensions from 51 x 51 mm to 533 x 609 mm with thicknesses from 0.5 to 4 mm and weighing up to 3 kg. This AOI machine has a resolution of 3.45 µm with a field of view measuring 60.5 x 60.5 mm and is capable of detecting defects such as component missing, tombstone, polarity issues, solder joint defects, and bridging. It includes lighting features such as axial and peripheral LED with a holographic diffuser for enhanced visibility. It features MYWizard, an AI-powered programming interface, that reduces programming time by up to 30% by leveraging auto-matchmaker for precise component recognition and machine learning algorithms for fiducial and polarity inspection. 

The MYPro I50X 3D AOI system offers comprehensive 3D inspection across SMT, THT, and press-fit components, pre-reflow and post-reflow, ensuring thorough defect detection. It is equipped with a robust toolbox for 2D and 3D inspection tests, covering component bodies, leads, solder joints, and various connectors, making it a versatile solution for quality assurance in electronics manufacturing. This equipment is available in an enclosure that measures 1,110 x 1,351 x 2,075 mm and requires a single-phase AC supply of 230 V. 

Product Specifications

Product Details

  • Part Number
    MYPro I50X
  • Manufacturer
    Mycronic AB
  • Description
    3D AOI Equipment for PCB Dimensions up to 533 x 609 mm

General Parameters

  • PCB Size
    51 x 51 mm to 533 x 609 mm
  • Resolution
    3.45 µm
  • Field of View
    60.5 x 60.5 mm
  • Defect Analysis
    Component Missing, Component Missing, Tombstone, Polarity, Solder Joint Defects, Bridging
  • Component Height
    - 5 to 20 mm
  • Conveyor Height
    860 to 960 mm
  • Lighting
    Axial and peripheral LED with holographic di?user
  • PCB Thickness
    0.5 to 4 mm
  • PCB Weight
    3 kg
  • Positioning Accuracy
    0.1 µm
  • Power Supply
    Single phase 230V, 50 Hz, 10A
  • Top Clearance
    40 mm
  • Bottom Clearance
    60 mm
  • Edge Clearance Top
    3 mm
  • Operating System
    Windows 10, 64-bit
  • X-Y Axis Resolution
    3.45 µm with subpixel technology - 13.7 µm native
  • Z-Axis Resolution
    Constant resolution of 1 µm over a 25 mm range in Z
  • Net Weight
    900 kg
  • Machine Dimension
    1,110W x 1,351D x (1,975–2,075)H mm
  • Humidity
    20 - 75 % (Without Condensing)

Technical Documents

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