B500

B500

Automated Optical Inspection (AOI) Equipment by ASCEN technology (2 more products)
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Product Specifications

Product Details

  • Part Number
    B500
  • Manufacturer
    ASCEN technology

General Parameters

  • PCB Size
    50 × 50 mm to 430 × 330 mm
  • Resolution
    15 µm
  • Field of View
    38 x 31 mm
  • Inspection Speed
    <200 ms/FOV
  • Defect Analysis
    Component Missing, Offset, Tombstone, Poor Soldering, Excessive Solder, Insufficient Solder, Bridging
  • Component Height
    8 µm:01005 chip
  • Conveyor Height
    850 to 920 mm
  • PCB Thickness
    0.3 to 5 mm
  • PCB Weight
    3 kg
  • PCB Tolerance
    ＜5mm or 2% of PCB diagonal length
  • Power Supply
    AC230 V 50/60 less than Hz 0.5 KVA
  • Top Clearance
    3.5 mm
  • Bottom Clearance
    3.5 mm
  • Operating System
    Windows 7 Professional
  • Net Weight
    550 kg
  • Machine Dimension
    900 x 1070 x 1310 mm
  • Humidity
    10 - 35 Degree C 35 - 80％ RH ( no dew )

Technical Documents
View more details on the manufacturer's website
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