PCB Trace's Advanced ENEPIG Plating Process Ensures High-Quality and Reliable Gold Ball Wire Bonding

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PCB Trace offers advanced capabilities in ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating, a widely adopted and highly reliable method for Gold ball wire bonding in PCB manufacturing. This cutting-edge process ensures enhanced solderability, excellent wire bonding, and a robust surface finish, positioning PCB Trace at the forefront of high-quality PCB production.

The ENEPIG plating process utilized by PCB Trace includes a base layer of electroless Nickel, followed by electroless Palladium, and topped with Immersion Gold, delivering an optimal balance between manufacturing ease and cost. This method is particularly suited for Gold ball wire bonding, where the Nickel layer typically measures 100-150 µin, the Palladium layer 4-10 µin, and the Gold layer 1-2 µin thick.

PCB Trace’s rigorous testing ensures the reliability of the plating process. The ENEPIG method is designed to prevent common issues like black pads associated with other plating methods, such as ENIG, and to offer superior co-planarity and solder joint reliability compared to electrolytic Nickel-Gold processes. With this advancement, PCB Trace continues to set new standards in PCB manufacturing, offering a reliable solution that meets the demands of high-density, fine-pitch components in modern electronic applications.

Click here to learn more about PCB Trace's ENEPIG Plating process.