Cutting-Edge PCB Fabrication Technology using Copper and Epoxy Filled Vias from Cirexx

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Cirexx, a provider of PCB layout, fabrication, and assembly services, produces advanced PCBs using their state-of-the-art copper-filled microvias and epoxy-filled thru-vias. This innovation promises to enhance performance and reliability in a range of applications, from telecommunications to aerospace.

Copper Filled Microvias:

Copper-filled microvias are designed to enhance both cooling and connectivity in PCB applications. These vias are integral for dissipating heat effectively and bridging connections between different board layers. The manufacturing process involves advanced techniques such as laser drilling, metalization with an electroless copper seed layer, and specialized electroplating. This meticulous process ensures that the microvias perform optimally, although it can contribute to higher manufacturing costs.

Epoxy Filled Vias:

Epoxy-filled vias, available in both non-conductive and conductive forms, offer significant design benefits. They include thru-holes in the circuit board that are filled with a non-conductive or conductive material known as epoxy resin. These vias are particularly useful for creating a flat surface for mounting components directly over the via and managing heat from critical elements like sensors and amplifiers. The production of epoxy-filled vias includes plating the via, filling it with epoxy resin, and capping it with copper. While this method provides versatility in design, it's important to note that epoxy does not conduct heat as efficiently as copper.

Similarities and Differences

Both copper and epoxy-filled vias serve the same purpose: they enhance the functionality and design of a circuit board. Both types aid in connecting different parts of a board, ensuring a more robust and effective PCB design. But they also offer distinct advantages:

• Copper-filled microvias allow fanning out of traces to the layer below for high-density components such as BGAs. They are also known for their ability to channel heat to plane layers and subsequently out to the edge of a board.
• Non-conductive or conductive Epoxy filled vias, on the other hand, are great when one needs a flat surface, especially if components are placed directly over the via. They can also save space in compact device designs.

The choice between copper and epoxy vias depends on the specific requirements of the application.

Impact on Production Lead Times

Incorporating filled vias can extend production times by approximately three days per design change. This reflects the added complexity of the manufacturing process, necessitating careful planning and execution.

Applications:

• Telecommunications: For improved signal transmission.
• Aerospace: Enhancing durability and performance in demanding environments.
• Medical Devices: Achieving complex design requirements.
• Automotive: Improving performance in electronics.
• Consumer Electronics: Offering compact and efficient designs.
• Industrial Electronics: Providing robust performance.
• Energy Sector: Supporting complex circuitry needs.

With over 40 years of expertise, Cirexx delivers high-performance PCB solutions, addressing the evolving needs of its clients.

Click here to learn more about Copper & Epoxy Filled Vias Cirexx.