Editorial Team - PCB Directory
May 21, 2024
BT-Epoxy, abbreviated from Bismaleimide-Triazine resin, is a thermoset resin employed in PCB fabrication. It stands out as a significant thermoset resin, offering a unique blend of properties and versatile applications. Also known as Bisphenol-T epoxy resin, it comprises bisphenol-T (BT) monomers and epichlorohydrin. Serving as the cross-linking agent, epichlorohydrin catalyzes the polymerization reaction with BT monomers, resulting in the formation of the epoxy resin.
Properties of BT-Epoxy
Crafted from bisphenol-T (BT) monomers and epichlorohydrin, BT-Epoxy, also known as Bisphenol-T epoxy resin, boasts an impressive array of properties. With a glass transition temperature of 180°C, a coefficient of thermal expansion of 27 ppm/°C, and a decomposition temperature of 325 °C, this material offers remarkable thermal stability. Additionally, its thermal conductivity of 0.35 W/m·K and dielectric constant of 3.70 @ 1 GHz make it an ideal choice for applications requiring efficient heat dissipation and superior electrical insulation.
With a dissipation factor of 0.014, volume resistivity of 10^7 MΩ - cm, and surface resistivity of 10^7 MΩ, BT-Epoxy demonstrates exceptional electrical properties, further enhanced by its electric strength and dielectric strength of 1200 V/mil and 1200 V/Mil respectively. Its moisture absorption of <0.05% and UL94 rating of V-0 underscore its resilience to environmental factors, while its peel strength, flexural strength, Young's Modulus, and density of 1.56 N/mm, 99.88 MPa, 31.9 GN/m², and 1.2 g/cm³ respectively highlight its robust mechanical characteristics.
These properties make BT-Epoxy a preferred choice for applications requiring high thermal stability, mechanical strength, electrical performance, and chemical resistance.
Applications of BT-Epoxy Substrate Material
The versatility of BT-Epoxy substrate material finds applications across multiple industries, including:
Advantages of BT-Epoxy Substrate Material
BT-Epoxy offers numerous advantages over other substrate materials, including:
Limitations and Challenges
Despite its many benefits, BT-Epoxy substrate material may encounter certain limitations and challenges, such as potential brittleness, susceptibility to degradation at very high temperatures, and precise curing conditions required to achieve optimal properties. Additionally, the relatively higher cost compared to some alternative materials may pose a challenge in cost-sensitive applications.
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