What are Cold Solder Joints?

What are the causes and effects of cold solder joints? How to prevent cold solder joints?

PCB Basics 
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Editorial Team - PCB Directory

Apr 28, 2023

A Cold Solder Joint is a type of soldering connection that is weak and has low reliability due to poor soldering technique or insufficient heat application during the soldering process. In a cold solder joint, the Solder may appear dull or grainy, indicating that it did not flow properly during the Soldering process, and may also have a weak mechanical bond to the component leads or circuit board.

Left: A cold solder joint vs Right: An ideal solder

An example of a cold solder joint may be a connection between a resistor and a circuit board where the solder appears dull and grainy and does not form a smooth, shiny surface. The solder may not have flowed properly, resulting in a weak and unreliable connection.

Cold solder joints occur due to poor soldering technique or insufficient heat application during the soldering process. This may be caused by insufficient preheating of the soldering area, improper use of the soldering iron, using the wrong type of solder, or not applying enough heat to the joint to allow the solder to flow properly. Inadequate cleaning of the components and circuit board before soldering can also contribute to the formation of cold solder joints.

How to Identify a Cold Solder Joint?

Cold solder joints can be detected by visual checking or using a magnifying glass. Primarily, a cold solder joint could look dull, whitish, convex, or deformed, which is very different from a proper solder joint.

Another way to detect a cold solder joint is by using a Multimeter. Since one of the effects of a cold solder joint is an increase in resistance. A Multimeter can be used to test for this – It can be used to test for an increase in electrical resistance or test the continuity of the circuit.

However, the detection of cold solder joints gets more challenging when a lead-free soldering process is used. So, it is best to try and avoid these cold solder joints from arising.

Causes of Cold Solder Joints

Several factors can lead to the formation of cold solder joints. We’ll discuss some of the most common causes in this section here:

  1. Inadequate Soldering Temperature: Soldering requires the application of heat to melt the solder and create a strong bond between the component leads and the circuit board. If the soldering iron is not hot enough, the solder may not melt and flow properly, resulting in a cold solder joint.
  2. Improper Soldering Techniques: Proper soldering technique is crucial to ensure that the solder flows evenly and forms a strong bond. If the solder is applied unevenly or the soldering iron is not applied properly, the solder may not flow properly, leading to cold solder joints.
  3. Using the Wrong Type of Solder: Different types of solders have different melting points. In case of wrong solder selection, the manufacturing process is affected because they use a temperature that will not be effective in melting the solder properly.
  4. Contamination of Soldering Area: Dirt, dust, and other contaminants can make your solder impure and hence lead to improper soldering. It's important to clean the components and circuit board thoroughly before soldering.
  5. Insufficient Preheating: Preheating the components and circuit board before soldering can help ensure that the solder flows properly and forms a strong bond. If the components and circuit board are not preheated enough, the solder may not melt and flow properly.
  6. Rushing the Soldering Process: Soldering requires patience and attention to detail, and rushing the process can lead to mistakes and cold solder joints. It's important to take the time to properly prepare the components and circuit board, apply the solder evenly, and inspect the solder joints to ensure they are strong and reliable.

Effects of Cold Solder Joints

Cold solder joints occur when the solder joint is not heated enough to melt the solder properly, resulting in a weak joint that may fail over time. The consequences of using electronic devices with cold solder joints can be significant and can lead to various issues.

The image represents a consequence of Cold Solder Joints: Electrical short-circuiting

One of the most commonly seen cold solder joint defects is intermittent electrical connections. These joints may function initially but may become faulty, and redundant ultimately. This can lead to issues like flickering or flashing lights or audio drops in audio devices. The intermittent connections can be frustrating and difficult to diagnose, especially when they only occur sporadically and function sometimes while being faulty the others.

Another consequence of cold solder joints is reduced current carrying capacity. When the solder joint is weak, it may not be able to handle the current that the component or circuit requires, leading to performance issues. This can cause the device to malfunction, leading to reduced performance or even total failure.

Total failure of the component or circuit is the most severe consequence of cold solder joints. When a joint is weak, it can break entirely, resulting in a complete loss of function. This failure may occur immediately after the device is assembled or after prolonged use.

To prevent these issues, it is essential to ensure that all solder joints are heated to the correct temperature and inspected to ensure that they are solid and reliable.

Prevention of Cold Solder Joints

Preventing cold solder joints requires attention to detail and a commitment to proper soldering techniques. Here are some practical tips for preventing cold solder joints:

  1. The use of solder material that is best for your particular application is vital. Choosing the right solder will prevent you from cold solder joints caused by wrong melting points, and other properties.
  2. Dirt and impurities can affect the soldering process. Hence, it is advisable to thoroughly clean the components before soldering to maintain proper flow.
  3. Preheating the components and circuit board before soldering can help ensure that the solder flows properly and forms a strong bond. Additionally, apply heat evenly to the components and circuit board for the solder to flow properly. Move the soldering iron around the component leads to ensure even heating.
  4. Apply the solder in a smooth, even manner to ensure that it forms a strong bond. Use the right amount of solder, and make sure it covers the entire surface of the joint.
  5. Cold solder joints can be difficult to detect, so inspect the solder joints carefully to ensure they are strong and reliable. Use a magnifying glass or microscope if necessary.
  6. Rushing the soldering process can lead to mistakes and cold solder joints. Take your time, follow proper soldering techniques, and inspect the solder joints carefully to ensure they are strong and reliable.
  7. Use an appropriate reflow profile as per the solder manufacturers' specification
  8. The peak temperature must be set at least 15°C above the melting point of the solder alloy for more than 45 seconds.
  9. Try to identify any vibration sources that can cause the solder to spread unevenly
  10. Use a good quality solder paste - alloy analysis should be done to check for contaminants

Conclusion

In summary, cold solder joints can have a negative impact on the performance and reliability of electronic devices. They occur due to poor soldering technique or insufficient heat application during the soldering process. Cold solder joints can be identified visually or by using a multimeter. Common causes include inadequate soldering temperature, improper soldering techniques, using the wrong type of solder, contamination of the soldering area, insufficient preheating, and rushing the soldering process.

The consequences of using electronic devices with cold solder joints can include intermittent electrical connections, reduced current carrying capacity, and total failure of the component or circuit. Therefore, it is crucial to ensure that proper soldering techniques are used, and the soldering area is adequately prepared and cleaned to prevent the formation of cold solder joints.

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