Polyflon PCB Boards

Polyflon is a thermally-stabilized, polyolefin thermoplastic bonding film, which is used as a substrate material for the manufacturing of multilayer PCB boards. The polyflon molecules are inert and as a result of this it is challenging to combine them with copper foil. The material requires a unique surface finish to be compatible with the copper foil at the time of PCB manufacturing. This unique treatment is performed through chemical etching on the polyflon surface, which adds to its surface roughness. An adhesive film can also be added on the polyflon surface to improve the adhesion.

Key Characteristics of Polyflon PCB Substrates:

• Low dielectric constant and low loss tangent at microwave frequencies
• Low melting point for temperature critical materials
• Can be reheated to reflow bonding film

Applications of Polyflon PCB Substrates:

• Can be used to develop stripline circuitry and multi-layer PCB boards 
• High frequency RF & Microwave applications
• Easier to attach circuit boards to heavy plated heat sinks

Click here to see a list of manufacturers that develop PCB Boards with a Polyflon Substrate.