Optimizing PCB Thermal Performance for XLamp® LEDs

  •  CREE
Optimizing PCB Thermal Performance for XLamp® LEDs

This application note outlines a technique to assist with the development of cost-effective thermal management for the XT, XP, XB, MX and ML families of XLamp® LEDs.

One of the most critical design parameters for an LED illumination system is the system’s ability to draw heat away from the LED junction. High operating temperatures at the LED junction adversely affect the performance of LEDs, resulting in decreased light output and lifetime.1  To properly manage this heat, specific practices should be followed in the design, assembly and operation of LEDs in lighting applications.

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