Optimized Reflow Profiling to Minimize Voiding

In this white paper we discuss several aspects of the challenges of printed circuit board (PCB) voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the challenges and some solutions, primarily solutions that focus on thermal profiling. Additionally, we will explore the tools that you may already have, those that are available to you right now, and how to improve your knowledge base regarding thermal profiling issues.