With the phasing out of CFC’s and HCFC’s, the electronic industry evolved standard solder pastes and fluxes from RA and RMA fluxes. These included several types of No-Clean, Aqueous, and Semi-Aqueous cleaning solutions. However, the advent of lead-free soldering and the progressive miniaturization of electronic devices further complicated the scenario for the suppliers of these cleaners.
Three factors mainly affect the cleaning performance of cleaning solutions:
HANSEN PARAMETERS - a characterization of the contaminant to be dissolved, signifying the solvency power of the cleaning solution.
SURFACE TENSION - important as the cleaning product has to dissolve contaminants under or around closely packed components.
PHYSICAL PARAMETERS -such as temperature, mechanical activities necessary, and the duration of the process.
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