In the modern world, complexity of electronic products has increased due to the demand for higher performance such as faster data transfers, better image processing, higher computing power, and greater functionality. This has resulted in higher component count in PCBs, higher signal frequencies of the order of 5GHz and more, high-speed interfaces such as HDMI, DDR-3/4, Gigabit ethernet, and HDI (High Density Interconnect) PCB technologies having blind and buried microvias. In the future, the demand for even higher performance from computers, mobiles, and communication devices would require PCBs to be designed to cope with even higher speed of operation and higher component densities.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR