Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices.

BGA Rework is now largely mature, although new supplemental processes that provide improved process control such as Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into existing processes if the rework technology that is used allows. So what are the next set of challenges that will need to be addressed in regard to Area Array and SMT Rework? The International Electronics Manufacturing Initiative or iNEMI has recently published its 2013 Technology Roadmap for the global electronics industry which includes a section dedicated specifically to rework and repair. Of particular interest and importance is iNEMI’s gap analysis which identifies future specific gaps and challenges that will result from such factors as government regulations, disruptive technologies and new product requirements....