Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis

This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. In this seminar Sbiroli will discuss:

- Printed circuit board assembly (PCBA) material’s selection & optimization (solder paste & board design)

- Proper storage & handling techniques

- Stencil selection

- Stencil printer setup

- Common solder paste printing defects & how to overcome

- Designing a reflow profile for low voiding & high reliability

- Understanding & mitigation of common reflow related defects including voiding, head-in-pillow (HiP), non-wet opens (NWO), graping & tombstoning