YINCAE to Exhibit Latest Products at SMTA Mexico 2019

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YINCAE Advanced Materials will be showcasing its latest technical advancements at the upcoming SMTA-Mexico 2019 event to be held from October 23-24 in Guadalajara, Jalisco Mexico. YINCAE is the world’s first provider of lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications.

The company offers SJEA for low, medium and high temperature solder alloy applications for unique applications. It also a provider of Under-Fills which not only offer high thermal conductivity and high Tg (245°C) but also can be used at over 400°C.

Featured Products at SMTA-Mexico 2019:

• SMT 158EN – A fast flow, high Tg and low CTE high temperature resistance underfill
• SMT 158UL – A room temperature operated fast flow and fast cure filled underfill
• SMT 158NN – A Non-flow and high purity liquid epoxy encapsulant
• SMT 256EP(T5) – A Solderable adhesive which is self-leveling and self-soldering adhesive and has been designed for high temperature Pb-free application
• NC 256 – The recently launched zero residues flux that offers excellent soldering wetting and eliminates the cleaning process. It has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfills that have been adopted by leading contract manufacturers and Tier 1 microelectronic customers. The company will be showcasing its most popular products at SMTA-Mexico 2019 at Booth #729. To schedule a meeting during the Expo, contact the company directly.