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TTM Technologies, a global manufacturer of PCB products and components, showcased its latest technology advancements at the International Electronics Circuit Exhibition (Shenzhen) 2019. The event was held at the Shenzhen Convention and Exhibition Center in Shenzhen, China, from 4th - 6th December 2019.
Building upon the theme of “Inspiring Innovation”, TTM Technologies’ technical experts conducted a series of sessions to share views on important industry trends and the company’s latest innovative technologies to help customers successfully address these trends. The sessions covered a range of important topics for the markets TTM serves, including – “mSAP Technology-Enabled Substrate-Like-PCB (SLP) Application”, “PCB Design Trend and Challenge for Telecom and Networking”, “Technologies for mmWave Application – the Values TTM brings to the Development of Radar PCBs”.
Every year, TTM takes advantage of the opportunities provided by the International Electronics Circuit Exhibition, one of the most important annual industry events in the Asia-Pacific region, to meet industry stakeholders face-to-face and exchange views on markets and trends. According to the company, it is a great opportunity to interact with the customers and to collaborate with them to provide innovative technical solutions to meet their evolving product requirements.
Since it was first staged in 2002, the International Electronics Circuit Exhibition (Shenzhen) fair, jointly organized by the Hong Kong Printed Circuit Association (HKPCA), Association Connecting Electronics Industries (IPC), and the China Council for the Promotion of International Trade Guangzhou Sub-council (CCPIT-GZ), has grown year by year and evolved from a modest regional event into the PCB industry's premier international platform for networking, information exchange, education, and keeping up with market trends and the latest innovations.
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