Transphorm and Weltrend Collaborate to Launch Integrated GaN System-in-Package (SiP)

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Transphorm and Weltrend announced the release of their first GaN System-in-Package (SiP). The WT7162RHUG24A is an integrated circuit designed for use in 45 to 100 watt USB-C PD power adapters charging smartphones, tablets, laptops, and other smart devices. It offers peak power efficiency of greater than 93%. Device samples will be available in the second quarter of 2023.

In addition to bringing a new product to market, this announcement marks another major achievement by Weltrend. This new GaN SiP now shows Weltrend’s commitment to the AC-to-DC power market as they offer a complete system solution using Transphorm’s SuperGaN® technology. For Transphorm, it is another key proof point that validates its GaN devices’ ease of interface and superior performance.

Transphorm will showcase the Weltrend SiP for the first time at the 2023 Applied Power Electronics Conference (APEC) in booth #853. The companies will also release details on the related WTDB_008 65W USB PD Power Adapter Evaluation Board during the event.

“The WT7162RHUG24A is the industry’s first publicly announced SiP using Transphorm GaN. It enables manufacturers to develop a less expensive system solution given fewer components are required and a smaller PCB can be used among other advantages. It also reduces system development time. Effectively, we’re removing design barriers for adapter manufacturers,” said Tony Lin, President, Weltrend. “Notably, this product also allows Weltrend to move into a new market. It is the first-ever SiP for our PWM controllers, validating our commitment to supporting high volume growth sectors. And, with the integration of the GaN FET, we’ve raised the level of performance output. A win for Weltrend, Transphorm, and our mutual customers.”

“The adapter fast charger market is a fast growing segment for GaN adoption today. We are gaining market share and continue to innovate, most recently with this GaN SiP, which allows for even easier use of our GaN devices,” said Primit Parikh, President and COO, Transphorm. “We’re excited to integrate our industry leading SuperGaN platform with Weltrend’s innovative adapter power controller technology. Weltrend has delivered a leading power conversion platform which creates a simple-to-use solution for adapter/fast charger customers that both companies can use to accelerate wins in this market.”

WT7162RHUG24A Specifications and Features

The new SiP integrates Weltrend’s WT7162RHSG08 multi-mode flyback PWM controller with Transphorm’s 240 milliohm, 650 volt SuperGaN® FET. The surface mount device is available in a 24-pin 8x8 QFN package, reducing PCB size. Other key specifications include:

• Peak Power Efficiency: > 93%
• Power Density: 26 W/in3
• Wide Output Voltage Operation: USB-C PD 3.0 and PPS 3.3V~21V
• Max Frequency: 180 kHz
• Targeted Topology: Flyback with QR Mode/Valley-switching Multi-mode Operation

Notable features include:

Target Applications and Availability

The WT7162RHUG24A SiP is optimized for use in high-performance, low-profile USB-C power adapters for mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, cameras, and more.

Click here to get more information about WT7162RHUG24A .