Summit Interconnect Elevates Semiconductor ATE Capabilities with Cutting-Edge Solutions

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In the fast-paced world of semiconductor testing, Summit Interconnect emerges as a formidable player, revolutionizing Automated Test Equipment (ATE) boards with its advanced capabilities and expertise.

Semiconductor ATE Revolution: ATE boards, critical components in testing highly intricate semiconductor chips, demand sophistication and precision. Summit Interconnect leads the charge in supplying PCBs tailored to the semiconductor ATE market. These boards are engineered to streamline testing processes, enabling clients to evaluate their designs efficiently and with enhanced reliability.

Specialized Testing Solutions: Summit's ATE boards boast an impressive layer count ranging from 40 to 60+, reflecting their complexity and performance-driven design. With a focus on specialized testing, Summit empowers clients to expedite testing procedures, ultimately accelerating time-to-market for semiconductor innovations.

Comprehensive Semiconductor Capabilities: At Summit, a diverse array of semiconductor capabilities is on offer, ensuring a comprehensive solution for clients. From reference design test boards to high aspect ratio ATE boards, the company's expertise encompasses bondable gold finishes, tight tolerance drilling/routing, copper balancing, and quick turnaround services.

High-Density Rigid Solutions: Summit's rigid capabilities redefine industry standards, encompassing HDI high-layer count boards, staggered micro vias, blind/buried vias, back drilling, multiple sequential laminations, via fill, and metal-backed/metalcore options. These cutting-edge solutions cater to the most demanding requirements of semiconductor testing.

Rigid-Flex and Flex Mastery: In the realm of rigid-flex and flex manufacturing, Summit Interconnect stands out as a pioneer. With proficiency in rigid-flex, bookbinder, multilayer, adhesiveless & adhesive constructions, the company offers a plethora of options including stiffeners, laser ablation, thin flex laminates, and diverse assembly options.

RF/Microwave Expertise: Summit's expertise extends to RF and microwave applications, leveraging a wide range of PTFE materials, mixed material stack-ups, plated cavities, edge plating, high-temperature lamination, mode suppression/stitching, buried resistors, and edge launch features. These capabilities underscore Summit's commitment to delivering state-of-the-art solutions across diverse technological domains.

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