SMTA Introduces the Ultra High-Density Interconnect (UHDI) Symposium to be Held on 26th March 2024

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The SMTA has introduced a new event for the electronics manufacturing industry on March 26, 2024, in Peoria, Arizona, USA. The Ultra High-Density Interconnect Symposium will be held at the Peoria Sports Complex. This event sets the stage for researchers, engineers, designers, and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns. The program will focus on all areas impacted by the technology including PCB Design, Fabrication, Assembly, and Reliability.

A co-located breakfast event will start the day with a discussion on workforce development, and identifying key competencies for semiconductor technology and PCB electronics. The breakfast is open to anyone interested in workforce development for electronics manufacturing, not just conference attendees, and an additional registration fee is required.

The UHDI Symposium invites thought leaders and experts from a broad spectrum of industries to contribute to discussion and idea sharing across a variety of topics as we all work together to shorten the time to move from prototyping to proven process in the high mix, low volume manufacturing environment. Some of the discussion topics include:

• Bridging the gap between OEM demands and Ultra HDI innovation
• Materials that redefine Ultra HDI possibilities
• Paradigm-shifting PCB fabrication techniques
• Assembly success: overcoming challenges in shrinking feature sizes
• Design strategies that address both complexity and performance
• Ensuring reliability in Ultra HDI solutions
• Interplay between Ultra HDI and the burgeoning semiconductor landscape

Altium and American Standard Circuits are the current sponsors of the symposium. Sponsorship opportunities are still available for this event.

Click here for more information on the Ultra High-Density Interconnect (UHDI) Symposium.