Rehm Group's Condenso Series: Advancing Condensation Soldering Technology

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Rehm Group, a renowned name in soldering technology, has unveiled its innovative Condenso series, designed to revolutionize condensation reflow soldering, also known as vapor-phase soldering. This cutting-edge technology employs the power of hot vapor to achieve soldering, with heat transfer capabilities up to ten times greater than conventional convection soldering methods. This makes the Condenso series particularly adept at handling large or high-mass circuit boards within a stable process atmosphere. The key to this exceptional performance lies in the utilization of perfluoropolyether, a highly efficient and inert heat transfer medium.

One of the Condenso series' remarkable features is its adaptability to various manufacturing scenarios, with or without vacuum assistance. The soldering process is adjustable, catering to even the most intricate and challenging assemblies. The proprietary injection process, developed by Rehm, enhances control during the condensation phase, allowing for personalized regulation of the soldering procedure. For those seeking flawless soldered joints, an optional vacuum module is available, effectively eliminating voids in the joints either post-soldering or as a pre-vacuum step.

What sets the Condenso series apart is its flexibility, enabling it to excel in diverse manufacturing environments. Whether handling sizable, weighty boards or demanding vacuum processes, the Condenso series can be tailored to meet the specific requirements of each setting. From batch operations to continuous soldering, Rehm ensures unparalleled process reliability across the board.

The Condenso series also caters to the intricate demands of power electronics manufacturing. The option for void-free soldering with unleaded solders made possible through a vacuum process, is a critical feature. The technology guarantees lower void rates, essential for top-tier power electronic components.

Key highlights of the Condenso Series include:

• Precise Reflow Profile Control: The patented injection principle facilitates reproducible control of the reflow profile, ensuring consistent soldering results.
• Sealed Processing Chamber: The system boasts a hermetically sealed chamber for optimal process integrity.
• Controllable Vacuum Process: Horizontal transport ensures secure module conveyance through the machine, allowing for precise control over the vacuum process.
• Effective Galden Management: The system prevents the spread of Galden® and incorporates active Galden® filtering.
• Advanced Process Monitoring: The integration of wireless WPS systems and cutting-edge software tools enables real-time process monitoring.

The Condenso series is available in various versions to suit diverse needs:

• CondensoXC: A compact solution offering optimum results with a minimal footprint.
• CondensoXS Smart: Designed for safe and efficient processes, leveraging the injection principle.
• CondensoXM Smart: An inline-capable system tailored for automated processes.
• Condenso Smartline: Perfect for power electronics series production.
• CondensoX-Line: Boasts horizontal transport capabilities for a seamless production process.

Rehm Group's Condenso series marks a significant leap forward in condensation soldering technology, offering manufacturers enhanced control, flexibility, and performance for a wide range of applications.

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