Optical Inspection System from Kurtz Ersa Redefines Precision in Electronics Manufacturing

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In a groundbreaking development for the electronics manufacturing industry, Kurtz Ersa, a leading innovator, introduces the Ersa MOBILE SCOPE, an advanced optical inspection system designed for fast and precise examination of hidden solder joints. This hand-guided system, equipped with cutting-edge technology, aims to elevate the standards of quality control in electronics manufacturing processes.

The Ersa MOBILE SCOPE, features a compact and portable video microscope tailored for inspecting solder joints, particularly in ball grid array (BGA), μBGA, CSP, and flip chip devices. The system's technology highlights include two quick-change objectives: 90° BGA optics with an approximate 280 µm gap and 0° macro zoom inspection optics. This allows for rapid and accurate inspection of hidden solder joints, enabling precise evaluation of various components.

One of the key features of the MOBILE SCOPE is its integrated dimmable LED illumination, ensuring optimal visibility during inspections. The system is equipped with an N-MOS color camera with a 5-megapixel resolution and a USB connection for digital image recording and analysis. Additionally, the MOBILE SCOPE comes with an extra LED fiber light included with BGA optics, enhancing its functionality for different inspection scenarios.

The Ersa MOBILE SCOPE is ideal for inspection at constantly changing locations and servicing needs, providing unmatched flexibility and speed. Its applications range from inspecting BGA, μBGA, CSP, and FlipChip devices to evaluating heel fills on QFP, SOIC, and other gull-wing terminated devices. The system also enables the assessment of wetting length and internal wetting on PLCC and J-terminated devices, enhancing the precision of inspections.

The MOBILE SCOPE specifications include its basic unit dimensions (LxWxH) of 114 x 36 x 51 mm (without cable) and a weight of 210g. The interchangeable optics include a 90° BGA module for inspecting hidden solder joints with gap dimensions from 50 to 1,500 µm and a supervisory module for fast, flexible inspections at high magnification.

This revolutionary inspection system is set to transform the way hidden solder joints are examined in the electronics manufacturing industry, ensuring higher quality, precision, and efficiency in the production processes.

Click here for more information about the Ersa MOBILE SCOPE and its capabilities.