Nordson to Demonstrate Smart Semiconductor Packaging Solutions at SEMICON Taiwan 2021

https://cdn.pcbdirectory.com/news/PCB_Cover_637751474458121647.jpg712370

Nordson Corporation, one of the world’s leading producers of precision technology, will demonstrate the latest solutions for semiconductor packaging and electronics manufacturing at the SEMICON Taiwan tradeshow booth #I2716, first floor. Experts will be ready to discuss innovations for fluid dispensing, bond testing, X-ray inspection, and plasma surface treatment for a smart and connected new world. SEMICON Taiwan will be held at TaiNEX 1, Taipei, China, December 28-30, 2021.

The tradeshow will showcase the following:

• Fluid dispensing equipment -- the ASYMTEK Forte®,  Vantage® systems, and the latest Vortik® progressive cavity pumps.
• Test and inspection products to be exhibited are DAGE bond testers, the SONOSCAN Gen7 acoustic microscope, and the DAGE Quadra X-ray system.
• Plasma experts will be ready to discuss MARCH plasma treatment equipment and technologies.

Nordson equipment is supported by trained and experienced technical staff who are ready to work with customers to improve their semiconductor packaging and electronics manufacturing operations. The Nordson team joins distributor partner CohPros to exhibit these leading technologies.