Nordson Electronics to Showcase Semiconductor Packaging Solutions at SEMICON Taiwan 2023

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Nordson Electronics Solutions, a global provider of electronics manufacturing technologies, will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor. At the booth, attendees can see these systems:

• The popular ASYMTEK Vantage fluid dispensing system. Nordson’s most advanced dispensing platform is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
• The newest ASYMTEK Forte fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuits, MEMs, and electromechanical applications.
• Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.

Experts will be ready to discuss how Nordson can support operations for reliable electronic products. SEMICON Taiwan will be held at Taipei Nangang Exhibition Center, Taipei Taiwan, September 6-8, 2023.

Click here to see PCB Directory's coverage of SEMICON Taiwan.

Click here to learn more about Nordson Electronics Solutions.