New Flexible PCB Laser Processing Solution Enables Highest Via Drilling Throughput in the Industry

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Electro Scientific Industries Inc, an innovator in laser-based manufacturing solutions for the micro-machining industry, has released a flexible PCB laser processing system. The new CapStone system offers 2X throughput improvement over its predecessor for processing blind and through hole vias ? the highest in the industry.

CapStone helps Flexible printed circuit (FPC) manufacturers keep pace with evolving technology requirements, such as the increasing use of blind vias and next-generation flexible materials. ESI’s new DynaClean beam positioning feature, enabled by its patented esiLens technology, reduces unproductive beam movement and provides multiple focus settings at every location. The company’s newest-generation beam positioning technology, AcceleDrill, takes advantage of the high power and high repetition rate of the esiFlex laser to deliver unprecedented processing efficiency.

Combined, these technologies allow FPC manufacturers to double their processing throughput without compromising quality, substantially lowering per-panel processing costs while maintaining high yields across a range of applications. CapStone systems are available immediately, either directly through ESI or through ESI channel partners world-wide.