MacDermid Alpha to Showcase Advanced Solutions for Electric Vehicles at PCIM Europe 2023 Event in Nuremberg

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MacDermid Alpha is set to showcase its advanced solutions for die, package, and die top-side attach during the PCIM Europe event held at the Nuremberg Exhibition Grounds from May 9 to May 11, 2023. The company's extensive expertise and product portfolio will be on display at booth 460 in hall 7, providing visitors with a glimpse of their innovative solutions for boosting power, range, and reliability in Electric Vehicles (EVs). Attendees can look forward to engaging with MacDermid Alpha's team of experts and gaining valuable insights into the latest developments in the field.

On May 10th at 10 am, Gyan Dutt, the Strategic Marketing Manager for Semiconductor Assembly at MacDermid Alpha, will take the Industry Stage in hall 7 to present his technical paper entitled "Sintering Innovations for Power Electronics Packaging and Assembly." The session will explore various sinter attach layer options for challenging applications beyond die attach and propose solutions for novel form factors and processes for die top-side and module attach. Attendees can expect comprehensive content that includes thermomechanical and power cycling reliability data for commercial modules, benchmarked against solder. Gyan will also highlight the potential for cycling improvement of up to 10-30X, providing valuable insights into the latest innovations in power electronics packaging and assembly.

MacDermid Alpha is powering your path to enhanced reliability of power inverters. We achieve this by improving the consistency of sintered joints and enabling higher operating temperatures. Highlighted at the show will be:

• Argomax 2148, a recent addition to the portfolio, is ideal for sintering large packages or components on gold or silver substrates. A key advantage, its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2148, delivers excellent performance and reliability for inverters in extreme temperature swings.
• The ATROX® range offers superior reliability and performance with rapid heat dissipation for higher efficiencies and operating temperatures. The ATROX 800HT series, a thermosetting conductive die attach adhesives with high thermal conductivity (>70 W/m-K) are designed for the no-pressure assembly of high-power exposed pad semiconductor packages. The ATROX die attach and clip attach process provides low modulus materials for large die sizes as well as superior adhesion to copper clip surfaces. A leading high thermal film with excellent bond line control, ATROX CF200-1D, is an electrically conductive die attach film with thermal conductivity of >20 W/m-K with no die tilting resulting in a high-yield assembly process.    

Julien Joguet, Director Power Modules, Inverters, and Industrial, said, “We are excited and looking forward to engaging with visitors at this year’s PCIM to not only demonstrate our ‘right first-time’ approach but to share our knowledge having worked on applications for power electronics in EV (Electric Vehicle) applications for over 15 years.”

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