MacDermid Alpha Showcases Polymer and Solder Paste Solutions at SMTA Silicon Valley Expo

MacDermid Alpha Showcases Polymer and Solder Paste Solutions at SMTA Silicon Valley Expo712370

MacDermid Alpha Electronics Solutions highlighted its latest polymer and solder paste offerings designed to meet the increasing demands for high-reliability performance and protection at the SMTA Silicon Valley Expo on December 8 at the Juniper Dome in Sunnyvale, California.

Featured solutions included MacDermid Alpha's expanding portfolio of Electrolube and HiTech polymer materials engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards. The Electrolube line of encapsulations resins, conformal coatings, and thermal interface materials and the ALPHA HiTech line of underfills, adhesives, and edgebonds are designed to deliver enhanced protection for assembled chip components for a broad range of applications including automotive, camera modules, and mobile. 

Additionally MacDermid Alpha promoted ALPHA OM-565 HRL3, its latest low-temperature solder paste which enhances electrochemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage-induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields.

Click here to explore Solutions from MacDermid Alpha Electronics Solutions.

Publisher: PCB Directory
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