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In a pioneering move, Kurtz Ersa has unveiled the VERSAPRINT 2 ULTRA stencil printer, integrating cutting-edge 3D inspection technology for superior precision in solder paste printing. Utilizing the advanced 3D LIST camera, this innovative printer meticulously evaluates the smallest solder paste depots, crucial for determining the printed volume and solder joint shape. A key advantage of the ULTRA lies in its dual functionality, serving as both a stencil printer and a 3D-SPI (Solder Paste Inspection) system.
Compared to standalone 3D-SPI systems, the VERSAPRINT 2 ULTRA offers unparalleled benefits:
Additionally, the VERSAPRINT 2 ULTRA boasts advanced features in the printhead and squeegee control, ensuring reproducible printing results. Optional weight compensation of the squeegee and printhead enables low squeegee pressures, optimizing performance. The stencil bottom cleaning process is highly customizable, with parameters for wet, dry, and vacuum cleaning, and controlled paper feed for consistent cleaning cycles and material usage.
Furthermore, the printer’s substrate handling capabilities are state-of-the-art. It clamps substrates securely between a hold-down bar and transport belt, preventing warping, minimizing bounce, and eliminating overlap in the substrate's edge area.
Ersa’s VERSAPRINT 2 ULTRA redefines precision in solder paste printing, ushering in a new era of efficiency and reliability in electronics manufacturing.
Click here to learn more about Kurtz Ersa
Click here to get the datasheet for VERSAPRINT 2 ULTRA
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