IPC's High Reliability Forum Highlights Safety in Medical, Auto, and Aerospace

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IPC's High Reliability Forum, taking place from October 17 to 19 in Linthicum (Baltimore), Md., will feature a range of topics on its agenda. These include ensuring the dependable performance of brain-implanted electronic prosthetics aimed at restoring hand movement in paralysis cases, enhancing the longevity of electric vehicle (EV) infrastructure, addressing testing standards and obstacles related to lead-free materials, and evaluating the reliability and maintenance aspects of secure airborne structures.

Presentation topics include: safety critical electronics considerations; military, aerospace, medical, automotive, e-mobility, and other applications with specialized reliability requirements; and others related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies, and test methods.

Speakers from the following companies include: Ed Reynolds, John Hopkins University Applied Physics Laboratory (opening keynote); Cynthia A. Chestek, Ph.D., University of Michigan; Raymond Zhao, Ph.D., Northrop Grumman Systems Corporation; Leslie Kim, MacDermid Alpha Electronics Solutions; Brian O’Leary, Indium Corporation; Theresa Campobasso, Exiger; William Capen, Honeywell; and Denis Barbini, Ph.D., Zestron.

“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to learn about the latest advancements, participate in industry discussions, and network with a respected community of professionals who are all focused on high reliability electronics,” said Bhanu Sood Ph.D., NASA Goddard Space Flight Center, and High Reliability Forum Technical Program co-chair. “And this year, the technical panel is stronger than ever, with well-rounded, industry-curated content focused on electronics with high reliability requirements.”

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Click here to learn more about High Reliability Forum, 2023.