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IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
Bringing together government agencies, the Defence Industrial Base (DIB), and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defence requirements critical to microelectronics assembly and packaging supply chain on shoring.
The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.
Keynotes include:
The event will kick off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging.
“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion, and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policymakers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”
Click here for detailed information on the agenda, and speakers or to register for the “On-Shoring Advanced Packaging and Assembly.”
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