International Electronics Circuit Exhibition 2019 Features the Latest in PCB Industry

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The 2019 International Electronics Circuit Exhibition (Shenzhen) - formerly known as the International Printed Circuit & APEX South China Fair was conducted from 4^th to 6^th December 2019. The event was organized by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA). Now in its 18^th edition, the show highlighted products and services spanning the entire PCB industry supply chain in 7 thematic zones, making it indispensable to industry participants. These included PCB Manufacturer, Electronic Assembly, Green Pavilion, Smart Automation Pavilion, Equipment Supplier, Materials Supplier, and Japan/Korea Pavilion.

The 3-day International Technical Conference, held annually in parallel with the show, has covered the latest hot topics in the PCB industry, offering valuable insights from industry experts. With 5G technology poised to transform the industry, the proliferation of connected devices will demand new and more sophisticated PCBs, forcing PCB manufacturers to raise their game across every area of activity.

Consequently, it has never been more important for industry participants to keep themselves up to date on the latest evolving trends. The Conference, which was staged in Hall 4, has presented an ideal opportunity to catch up on some of these developments, seeking to inspire the audience, guide them in managing the increasingly complex challenges facing the industry, and help them transform their business to a new level.

Insights from Top Industry Experts on the Latest Hot Topics

The 2019 Conference has featured a strong line-up of speakers including international specialists and technical experts to address the hottest issues, covering both market trends and technical updates. The Conference opened with a keynote speech from Mr. Canice Chung, Chairman of the Hong Kong Printed Circuit Association (HKPCA). This was followed by another keynote speech from Mr. You Lei, Chairman of the China Printed Circuit Association. The HKPCA and CPCA are joint organizers of the event.

Industry Experts at the Conference:

• Mr. Liu Zhe, Chief Engineer, Institute of Manufacturing Engineering, ZTE Corporation, delivered a speech on the topic “The Challenge and Opportunity of 5G High Frequency to PCB and PCBA”. Mr. Liu is a well-known expert who has published numerous books and papers on issues related to PCB manufacturing.
• Dr. Hayao Nakahara, President, N.T. Information Ltd., addressed the topic “Which Way the PCB Industry is Heading For?” Dr. Hayao Nakahara is a respected consultant who advises PCB manufacturing companies around the world. 
• Dr. Shiuk-Kao Chiang, Managing Partner of Prismark Partners, a leading electronics industry consulting firm, gave a PCB Market Update. Prismark has developed business and service relationships with most of the leading electronics, semiconductors, packaging, assembly, PCB and material companies.
• Mr. Lin Ting Hao, Senior Project Director, Advanced Product Development/Advanced Technology Center, Kinsus Interconnect Technology Corp.,spoke on “IC Substrate Technology Characteristics Study”. Mr. Liu was the consultant of the Taiwan Printed Circuit Association (TPCA) for 18 years and has published more than 20 PCB-related books.
• Mr. James Tam, Project Manager, Robert Bosch Co. Ltd. discussed “Challenges and Opportunity to PCB Material and Processing Technology Bring from Automotive Electronics”. Mr. Tam is responsible for the development of PCB technology for automotive electronics at Robert Bosch.

Updates on Current Trends, Research and New Products

In addition to these major presentations, other industry leaders have given presentations on a variety of market trends, research findings, and their latest product innovations. Topics include:

• Status of VCP Process and Development Trend of Copper Plating Brightener for VCP
• Novel Antenna Designs                                                        
• Drilling Solutions for 5G
• Wirelaid—Next Generation Heavy Copper Technology for High-Current PCB & E-Automotive PCB
• Fabrication & Reliability of Rogers Automotive Grade Materials
• 5G—mmWave Technology Challenges for PCB Manufacturing
• Removal of Total Nitrogen, Reuse of Nitric Acid
• Future LDI Technology Development Trend
• Functional Film Application of PCB/FPC
• Next Gen. DC Plating Solution “ELECTROPOSIT(TM) 1600” for High Layer Counts

Click here to know more  about the International Electronics Circuit Exhibition 2019.