IEEE EPS Electronic Components and Technology Conference 2023 Sets Attendance Record in Orlando

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The IEEE EPS Electronic Components and Technology Conference (ECTC) 2023 took place in Orlando, Florida at the newly renovated JW Marriott Orlando, Grande Lakes Hotel, from May 30 to June 2, 2023. Twenty-six countries were represented in the 1,619 attendees from industry professionals, academia, and students who were a part of the international microelectronics packaging conference.

The conference showcased several highlights, including its second-highest attendance in 73 years. The technical program comprised 379 papers across 36 oral and 5 interactive sessions, with a dedicated session for students. Special sessions covered topics like photonics, heterogeneous integration, and the CHIPS Act. Networking opportunities, including receptions and a career fair, were available, along with 16 Professional Development Courses. The event garnered support from Platinum Sponsors Amkor Technology, ASE, and JCET, as well as Gold Sponsors and Silver Sponsors. The Tech Corner hosted 122 exhibit booths, displaying cutting-edge technologies and services. Overall, the conference provided a platform for knowledge exchange, networking, and professional growth in the electronics and semiconductor field.

The ECTC has an extensive technical committee consisting of over 230 industry experts who volunteer year after year to curate the program.  All abstracts get over 20 peer reviews by the technical committee. This year abstract acceptance rate was around 60%.  The manuscripts are then reviewed for technical content, plagiarism, and quality prior to publication.

The 73rd ECTC was a four-day event this year with well-received new program features. One of the most popular changes was the addition of special sessions on Tuesday and Wednesday mornings. These sessions featured talks on a variety of topics from invited speakers.  Another popular change was the shortening of technical presentations. The keynote address on Wednesday, which was given by Michael Manfra, Bill and Dee O'Brien Distinguished Professor of Physics and Astronomy at Purdue University, was also a highlight of the conference. The CHIPS Act is an important milestone for strengthening the US manufacturing of electronics packaging in North America. The ECTC had 3 special sessions covering the CHIPS ACT  including one on building the Packaging ecosystem in North America was co-chaired by Nancy Stoffel of GE Research, Jan Vardaman of TechSearch International, and William Chen of ASE.

The first conference was held in 1950, and it was attended by just a few dozen people. The conference was focused on the packaging of electronic components, and it was a way for engineers to share their knowledge and experiences. Over the years, ECTC has grown in size and scope. The conference now attracts over 1500 attendees from all over the world. Overall, the 73rd ECTC was a great success. The new program features were well-received, and the conference provided a valuable opportunity for attendees to learn about the latest advances in electronic components and technology.

The 74th ECTC will be held May 28-31, 2024, at the Gaylord Rockies Resort and Convention Center in Denver, Colorado. 

Click here for abstract submission for the 74th ECTC (October 8th deadline).

Click here to check out more about ECTC on its Linkedin.

Click here to check out the Pictures from the event.