IDTechEx Analyses Advanced Semiconductor Packaging, Highlighting Trends and Future Applications

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IDTechEx, a leading market research firm, has released a new study on advanced semiconductor packaging technologies, has released the study, titled "Advanced Semiconductor Packaging 2023-2033" which analyzes the market prospects, key players, and recent developments in advanced semiconductor packaging technologies. This study highlights the growing importance of these technologies due to the slowing of Moore's Law and the rising costs of monolithic Si IC development and manufacturing.

According to the report, the primary challenge in the shift from 2.5D to 3D is to scale the size of the bumping pitch. Advanced semiconductor packaging technologies such as high-density fan-out, 2.5D IC, and 3D IC packaging technologies are becoming increasingly crucial for future data-centric applications. IDTechEx has identified four main application areas for advanced semiconductor packaging: high-performance computing (HPC) applications/data centers, communication networks, autonomous cars, and consumer electronics.

The report reveals that the increasing demand for data processing is the primary driving force behind the growth in these application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies. For HPC applications/data centers, 2.5DIC technologies that use Si interposer or Si bridge are the preferred option, despite their higher cost, due to their superior data processing capabilities. In contrast, consumer electronics such as smartphones or smartwatches focus on miniaturization and cost, with organic-based packaging technologies being the top choice.

In 5G and beyond communication, the key challenge is transmission loss. Hence, advanced packaging technologies are used to bring the antenna closer to the RF IC chip, minimizing transmission loss. "Antenna-in-package (AiP)" is currently the most viable option for 5G mmWave, while "Antenna on chip/wafer (AoP)" is still under intense development to reduce costs.

For future autonomous vehicles, the heterogeneous integration of CPUs and other components, such as HBM and reliable power delivery systems, will create new opportunities for advanced semiconductor packaging and innovation.

IDTechEx's report provides a comprehensive examination of the semiconductor market as a whole, leveraging the firm's expertise and years of research in data centers, autonomous vehicles, 5G, and consumer electronics. The report offers insights into how advanced semiconductor packaging is influencing various industries and what the future may hold.

IDTechEx's market research is differentiated through the primary information gathered, technical depth, and unbiased appraisals. The firm covers a wide range of topics and helps understand the industry's pain points and unmet needs.

Click here to view the study titled "Advanced Semiconductor Packaging 2023-2033".

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