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Epec Engineered Technologies, a company designing and manufacturing high-reliability printed circuit boards, custom battery packs, user interfaces, RF products, cable assemblies, and flexible heaters for OEMs around the world announced that it has invested more than $1M in new equipment at its NetVia Group PCB manufacturing facility located outside of Dallas, Texas. NetVia Group is a manufacturer of high-reliability, advanced circuit technology.
Specifically, they have added an Orbotech Dimension 6 AOI with Microvia inspection capability, a Mivatek 200L LED laser direct imaging system, a Microcraft EMMA Flying probe electrical tester with 1000V HiPot testing capability, along with several of the newest high-end metallurgical microscopes and an automatic metallographic grinding and polishing machine to dramatically improve throughput in our laboratory.
“Since the acquisition of NetVia by Epec Engineered Technologies in November of 2020, the growth of our business has required that we increase our capacity and our equipment resilience to ensure that we can meet our customers’ delivery and technology needs. We are dedicated to ensuring that we can manufacture high-technology rigid circuit boards and rigid-flex PCBs for our customers, which will require us to increase our equipment in terms of capacity and capability every year,” stated Ed McMahon, CEO of Epec Engineered Technologies.
The equipment that has been installed is the highest technology available in terms of speed and accuracy which increases NetVia’s ability to manufacturer PCB with 3/3 lines and spaces, thousands of test points per part, and ensuring that PCBs with even the smallest microvias are inspected using machine technology.
Jeff Forbus, President of NetVia, said: “Our team is dedicated to our customer success and with the addition of this equipment we can now move even faster to help our customers get their product to market faster. Printed circuit boards require a constant focus and attention to detail and these additions are going to help us with both.”
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