BTU's TrueFlat Tech: Optimal Uniformity at SEMICON Taiwan 2023

https://cdn.pcbdirectory.com/news/BTU7000_638294929009806223.png712370

BTU International, a prominent provider of cutting-edge thermal processing solutions for the electronics manufacturing industry, is set to showcase its state-of-the-art TrueFlat™ reflow oven technology at booth #M1039 during SEMICON Taiwan. This exhibition is slated to occur from September 6 to 8, 2023, at the TaiNEX 1 & 2 venue in Taipei.

“Flat substrates are an industry challenge that requires special processing,” says Joe Yang, product manager at BTU. “That’s why the BTU TrueFlat technology ensures that even the most minimal substrates are held flat through the entire reflow process.” Designed as an addition to the industry-leading Pyramax platform, the TrueFlat technology addresses the critical challenge of substrate warpage.

One of the standout features of TrueFlat technology is its exceptional uniformity, made possible by integrating Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15 to 0.30mm, TrueFlat technology guarantees consistent flatness. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.

Click here to learn more about SEMICON Taiwan, 2023.

Click here to learn more about BTU and its products.