Averatek Announces A-SAP License Agreement with Firan Technology Group

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Averatek Corporation has announced Firan Technology Group (FTG) as an A-SAP licensee. A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.

Brad Bourne, president and CEO of FTG said that as a trusted partner that provides solutions to the aerospace and defense market, FTG is pleased to be one of the first global corporations to partner with Averatek and implement the A-SAP process. He also said that FTG believes that semi-additive manufacturing processes will provide many benefits in printed circuit board performance and they look forward to working with Averatek and their customers to develop these processes and achieve these benefits.

Haris Basit, CEO of Averatek said that they are delighted to be working closely with FTG and that the A-SAP technology aligns with the FTG commitment to high-quality and high reliability. Averatek’s ultra-high-density process represents a strong complementary capability for support of FTG’s next-generation electronics.

Averatek A-SAP is an advanced manufacturing process for printed circuit board fabrication with trace and space widths as narrow as 15 microns. This process can dramatically reduce the area, layer count and weight of electronics systems as well as provide significant RF benefits.  A-SAP can be easily integrated with traditional PCB manufacturing equipment and materials.