Atotech Presents Latest Solutions at SEMICON Taiwan

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Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, is showcasing its latest solutions at the SEMICON Taiwan 2019 event. The exhibition is being held at the Taipei Nangang Exhibition Center from September 18 – 20.

SEMICON Taiwan is an important platform that connects Taiwan and global microelectronics ecosystems, and also provides a bridge that facilitates smooth collaboration between the electronics industry, government, academia, and research institutions.

Atotech’s experts are present at booth K2376 on the 1st floor to discuss the latest technology, trends, and future requirements.
Highlights at the booth will include:

• Spherolyte Cu UF3 – a high purity ECD copper process that enables stable and optimal mechanical properties within a wide process window
• AgPrep – an ultimate non etching adhesion promoter for silver surfaces
• MultiPlate – a new system platform for FOWLP / FOPLP

Atotech’s semiconductor expert, Dr. Ralf Schmidt, is also set to talk on “Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry” in the session, ´SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 3´ on Friday, September 20.

Visitors to the show are invited to attend this presentation and stop by Atotech’s booth K2376 to learn more about this and other innovative products, equipment, and process solutions Atotech provides to the semiconductor industry.