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AIM Solder, a global manufacturer of solder assembly materials, has announced its participation in the SMTA International 2024 conference, taking place October 20-24 at the Donald E. Stephens Convention Center in Rosemont, IL.
AIM Solder will be exhibiting at Booth #2725, where attendees can explore the company’s latest innovations, including the award-winning NC259FPA Ultrafine No Clean Solder Paste, and engage with AIM’s team of experts.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die-attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
AIM Solder Content Specialist, Gayle Towell will also be sharing expertise across several key sessions during the conference:
With master’s degrees in mathematics and physics from the University of Oregon, Gayle Towell brings nearly two decades of experience in higher education, technical writing, and creative writing to her work at AIM Solder. Gayle is instrumental in producing technical and research-based materials, while also collaborating with industry partners on various projects.
AIM Solder invites all SMTAI attendees to visit Booth #2725 to learn more about our superior soldering products and how our technical expertise can support your manufacturing processes. We look forward to engaging with industry professionals and exploring collaborative opportunities.
Click here to learn more about SMTA event coverage on PCB Directory.
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