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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, has announced that they will feature their new low-voiding, no clean paste along with their full line of solder assembly materials at Productronica, scheduled to take place on November 16th-19th, 2021 at Messe München in Munich, Germany.
The company will launch its newly developed solder paste engineered to solve one of the industry’s most difficult challenges for BGA and BTC packages. AIM studies show that solder joint reliability and thermal dissipation concerns are significantly reduced with its new no-clean paste.
AIM will also highlight its REL22™ and REL61™ alloys and NC273LT low-temperature solder paste. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement. AIM’s REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace, and LED lighting. REL61 is ideally suited for industries that require a cost-effective alternative to SAC305 with no loss of processing performance or durability.
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