1. Home
  2. Directory
  3. PICA Manufacturing Solutions
PICA Manufacturing Solutions

PICA Manufacturing Solutions

(0 reviews)
  • United States, New Hampshire, Derry
  • 18557422634
  • 4 Ash Street Extension
PCB Assembly Quotes
PCB Design Quotes
PCB Stencil Quotes

When confronted with electronic challenges, accessing deep industry knowledge is essential. Electronics manufacturing is characterized by its high specialization, where expert knowledge is scarce and typically concentrated within a small, elite group of engineers. PICA stands out in this context, employing some of the industry's most talented engineers from across the globe, including Asia, Europe, and North America. These professionals bring together extensive expertise in a broad array of areas, such as PCBs (Printed Circuit Boards), FPCs (flexible circuits) , rigid-flex technologies, component assembly, printed electronics, and turnkey solutions.

With 30 years of experience, PICA not only capitalizes on its robust manufacturing capabilities located in...show more

Supported PCB Services

Profile Menu

PICA Manufacturing Solutions

PICA Manufacturing Solutions

PCB Assembly Quotes
PCB Design Quotes
PCB Stencil Quotes

Assembly Capabilities

This company provides PCB Assembly services.
No Details Added.
Board Type
Assembly Type
PCB Sides
Board Size
  • Max. Board Thickness: 8mm (0.315in), Min. Board Thickness: 0.25mm (10mils)
Board Shape
  • Space & Trace: 50µm (2mils), Micro Via: Laser 75µm (3mils) Drilling 150µm (6mils), Controlled Depth Drilling, Panel & Pattern Plating, Max. PTH Aspect Ratio: 16:1
Stencils
  • Stencil size (mm) 340*470 - 737*737, Print position accuracy ±25µm, Printing size (mm) 50*50 - 510*508.5, Stencil thickness (mm) 0.05 - 5mm, Warpage < Diagonal 1%, Minimum printing component size (mm) 01005 & 0.3mm PITCH (IC), Applicable Product PCB, FPC, & R-Flex
Coating
  • Conformal Coating
Testing
Soldering Type
Order Type
Industries

Design Capabilities

No Details Added.
Design Service
Design Software
Industries

Design & Engine Capabilities

PICA Layout Design Advantage

• Application Engineer Assigned to Each Design Project 

• 24/7 Application Engineering & Design Support 

• PCB Designs for Consumer, Medical, Industrial, Safety & Security, and Wearable Market Applications 

• Manufacturability Built into Each Design (DFM)

 • Documentation Package Creation (Including Fabrication & Assembly)

Design Experience

• Impedance Control Modeling for Signal Integrity

• High Frequency Signals

• R-Flex Designs

• HDI Designs

• BGA & Micro-BGA Layouts

• EMI Shielding Using Advanced Materials

• Thermal Management Using Metal Core or Metallized Substrates

• Etched Foil Heater Flex Design

Stencil Capabilities

No Details Added.
Stencil Type
Stencil Fiducials
Industries

Solder Paste Dispensing Method and Specifications

Selective Solder Paste Jetting

Smallest solder dot & pad size — Min dot diameter = 250µm, Pad size (min) = 250µm

Jet printing frequency —  1,080,000 dph (high-speed option)

Single dot accuracy —  40µm

Position resolution — 0.2µm

Maximum board size —  508 x 508mm (20" x 20")

Minimum board size —  70 x 40mm (2.7" x 1.6")

Board thickness range — 0.4 - 6.0mm (0.016" - 0.24")


Stencil Printer

Stencil size (mm) —  340*470 - 737*737

Print position accuracy —  ±25µm

Printing size (mm) —  50*50 - 510*508.5

Stencil thickness (mm) —  0.05 - 5mm

Warpage —  < Diagonal 1%

Minimum printing component size (mm) —  01005 & 0.3mm PITCH (IC)

Applicable Product —  PCB, FPC, & R-Flex


Web Analytics