GenX 130

The GenX 130 from Pacific X-ray Imaging is an X-ray Inspection System. It has an inspection area of up to 39.4 (X) x 45.7 (Y) cm and can handle PCBs with dimensions up to 15.5 x 21.0 inches. This inspection system has a focal spot of size 30 µm that magnifies component and PCB images to over 665x of their original sizes and see assembly defects clearly. It has a spatial resolution of more than 40 lp/mm that generates high-quality images for inspection. The system uses a 4”/2” (10 cm/5 cm) dual view X-ray image intensifier for detecting an array of PCB defects including cold solder joints, solder dewetting, or dendrite growth amongst others. 

The GenX 130 has a specialized design that allows for the inspection of large-board, high density heat sink packaging, making it versatile for various applications. It requires minimal maintenance, enhancing its efficiency and reducing downtime. The system is equipped with a 2-axis X/Y manual manipulator for precise adjustments, and offers the option of a tilt/rotate fixture for added convenience. It utilizes a Windows 10 Pro image processor (standard) with PXi-Pro Image Analysis and provides advanced image processing capabilities. This X-ray inspection system is available in an enclosure that measures 57 x 33 x 44 inches and has a net weight of just 544 kg. It requires an AC supply.