SACX0307

SACX0307

Solder Paste by Shenzhen BBIEN Technology Co.,Ltd (20 more products)

Note: Your request will be directed to Shenzhen BBIEN Technology Co.,Ltd

Product Specifications

Product Details

  • Part Number
    SACX0307
  • Manufacturer
    Shenzhen BBIEN Technology Co.,Ltd

General Parameters

  • Type
    Lead Free
  • Flux Type
    No-Clean
  • Alloy
    SnAgCu
  • Alloy Composition
    Sn99.244Cu0.7
  • Metal Content
    0.9
  • Particle Size
    T3(25 - 45 µm), T4(25 - 38 µm), T5(15 - 25 µm), T6(10 - 18 µm), T7(5 - 12 µm)
  • Melting Point
    225 to 230 Degree C
  • Package Type
    Syringe
  • Net Weight
    500 g

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