BBIEN TLSP-01

BBIEN TLSP-01

Solder Paste by Shenzhen BBIEN Technology Co.,Ltd (20 more products)
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Product Specifications

Product Details

  • Part Number
    BBIEN TLSP-01
  • Manufacturer
    Shenzhen BBIEN Technology Co.,Ltd

General Parameters

  • Type
    Leaded
  • Alloy
    SnBi
  • Alloy Composition
    Sn42.0/Bi58.0
  • Particle Size
    T3(25 - 45 µm), T4(25 - 38 µm), T5(15 - 25 µm), T6(10 - 18 µm), T7(5 - 12 µm)
  • Melting Point
    138 Degree C
  • Package Type
    Cartridge, Syringe, Jar
  • RoHS
    Yes
  • Shelf Life
    6 Months
  • Storage Temperature
    3 to 8 Degree C
  • Net Weight
    100 g, 500g

Technical Documents
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