BBI-LFWSSP02

BBI-LFWSSP02

Solder Paste by Shenzhen BBIEN Technology Co.,Ltd (20 more products)

Note: Your request will be directed to Shenzhen BBIEN Technology Co.,Ltd

Product Specifications

Product Details

  • Part Number
    BBI-LFWSSP02
  • Manufacturer
    Shenzhen BBIEN Technology Co.,Ltd

General Parameters

  • Type
    Lead Free
  • Flux Type
    Water Soluble
  • Alloy
    SnBi
  • Alloy Composition
    Sn42.0/Bi58.0
  • Particle Size
    T3(25 - 45 µm), T4(25 - 38 µm), T5(15 - 25 µm), T6(10 - 18 µm), T7(5 - 12 µm)
  • Melting Point
    138 Degree C
  • Package Type
    Syringe

Technical Documents

Web Analytics