Typical TSC Reflow Profile I

Typical TSC Reflow Profile I

Solder Paste by MBO (UK) Ltd (20 more products)

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Product Specifications

Product Details

  • Part Number
    Typical TSC Reflow Profile I
  • Manufacturer
    MBO (UK) Ltd

General Parameters

  • Type
    Lead Free
  • Alloy
    SnAgCu
  • Alloy Composition
    Sn95.5Ag3.8Cu0.7
  • Package Type
    Cartridge, Jar
  • Net Weight
    250 g, 500 g, 1 kg

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