Note: Your request will be directed to MacDermid Alpha Electronics Solutions
The OM-565 is a zero-halogen low-temperature solder paste designed to reduce defects caused by warpage in chip-scale packages that are temperature sensitive. It allows for minimizing post reflow defects such as Non-Wet-Open (NWO) and Head-in-pillow (HIP) because of the solder paste used. It enables the assembly to reach peak reflow temperatures up to 175°C as well as superior wettability.
The low melting point reflow increases the energy efficiency and reduces the energy costs involved in the assembly process. It even offers compatibility with contact rework applications with 8-hour stencil life in ambient and elevated conditions.
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