Note: Your request will be directed to Indium Corporation
The Indium8.9HF from Indium Corporation is a lead-free, no-clean flux type solder paste that is specially formulated for use in electronic assembly applications. It is an alloy composition of 95.5% tin, 4% silver, and 0.5% copper, providing excellent performance and reliability.
This solder paste has a metal content of 88.75-89%, with a melting point range of 230 to 260 degrees Celsius. This ensures a strong, reliable bond and minimal thermal stress on the components during the soldering process. Additionally, The Indium8.9HF has a wide process window which makes it suitable for a variety of applications.
The Indium8.9HF is packaged in a convenient cartridge that is easy to use and handle and has a shelf life of one year when stored at a temperature of fewer than 10 degrees Celsius.
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