SB6-HLGQ-MSD

SB6-HLGQ-MSD

Solder Paste by GENMA (25 more products)

Note: Your request will be directed to GENMA

Product Specifications

Product Details

  • Part Number
    SB6-HLGQ-MSD
  • Manufacturer
    GENMA

General Parameters

  • Alloy
    SnBiAg
  • Alloy Composition
    Sn42.6/Bi57/Ag0.4
  • Particle Size
    T4 (22 - 38 um)
  • Melting Point
    139 to 141 Degree C
  • Package Type
    Jar, Cartridge
  • RoHS
    Yes
  • Shelf Life
    4 Months
  • Storage Temperature
    10 Degree C
  • Net Weight
    500 g, 1.2 kg

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