AMP OnePT

The AMP OnePT from FCT Solder is a Lead-Free Solder Paste that can be coupled with Solder alloys like SAC305, Sn/Ag 3.5%, SAC0307, SN100C, SN100CV, LF-C2, TempSave B37 and anti-tombstoning mixtures. It provides a highly reliable solution for harsh temperatures when coupled with SN100CV or LF-C2 alloys. This solder paste can be combined with TempSave B37 alloy (Nihon Superior) which contains 37% Bismuth and eliminates the brittleness issues of standard Sn/Bi57/Ag1 and Sn/Bi58 alloys providing an exceptionally low-temperature solution. 

The AMP OnePT has been formulated to generate flux residues that are pin-testable for over 5 days. It supports a bead size of 1.0 to 2.5 cm and a print speed of 20 to 200 mm/s. This solder paste has exceptional voiding performance, printability, and reflow performance with exceptional wetting, very low solder balling, and graping. It passes JIS SIR & ECM and Bellcore Telcordia SIR & ECM tests. This solder paste is halide and halogen-free to improve long-term reliability. It is available in 500 g jars, 500-1300 g cartridges, and 30/100 g syringes.