PICO

The PI PICO from Mycronic is a Solder Paste Inspection Equipment. It features a 80 MP, 12-bit CMOS camera sensor to capture intricate details and has an imaging speed of 3 seconds per FOV. This machine has an inspection camera POV from 1160 x 55 mm to 350 x 55 mm, ensuring an adjustable and wide-phase inspection. The system can accommodate PCBs with dimensions ranging from 51 x 51 mm to 350 x 533 mm with a PCB thickness from 0.1 to 7.5mm. It supports multiple conveying directions (Left to right, right to left, left to left, right to right) and provides automatic conveyor width adjustment. The conveying height ranges from 830mm to 930mm (standard) or 900mm to 1,000mm (optional). Conveyor length options include 1,000mm (standard) or 800mm (optional). 

The PI Pico – 3D SPI delivers highly accurate 3D inspection through patented Z-referencing technology for paste volume measurement. Z-referencing captures numerous references across the extensive 3D field of view for precise paste volume measurement, unaffected by board warpage. It enhances process control through automatic pad grouping, producing extra-large 3D review images for diagnostics.