RO400FC-C

The RO400FC-C from Essemtec is a Reflow Soldering Equipment that offer zone regulation, profile storage, and high air circulating volume for complex PCBs. Utilizing full convection heating, they ensure uniform temperature distribution across PCBs, with features like a 400 mm process width, optional flying thermocouples, and integrated microprocessor. It includes closed-loop controlled conveyor drive systems and integrated microprocessor control with LCD. This equipment is designed for complex SMD boards and new package technologies, delivering optimal efficiency for lead-free solders.

The RO400FC-C has one cooling zone and four heating zones. The heating zone length is 400 mm, which is heated via convection to a temperature range of around 290°C. It can accommodate PCBs of maximum width from 60 to 400 mm. This equipment has a chain and mesh conveyor system to transport PCBs that is controlled by microprocessors. The conveyor direction is from Left to right, and conveyor speed is between 100 to 800 mm/min (3.9" - 31.5"/min). It is available in an enclosure that measures 2800 x 914 x 1350 mm (L x W x H) and requires an AC supply.