MCL-E-770G (Type R)

MCL-E-770G (Type R)

PCB Laminates by Resonac Corporation (12 more products)
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The MCL-E-770G (Type R) from Resonac Corporation is a PCB Laminates with Tg 300 to 330 Degree C. More details for MCL-E-770G (Type R) can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-E-770G (Type R)
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp, Halogen-free
  • Tg
    300 to 330 Degree C
  • Halogen Free
    Yes
  • Applications
    Semiconductor packages. (FC-CSP, PoP, SiP), Thinner module
  • Cte xy
    4.0 to 6.0 ppm/Degree C
  • Peel strength
    0.7 to 0.9 kN/m, 0.8 to 1.0 kN/m
  • Size
    14 x 14 mm
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    0.8 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 430 to 450 Degree C, Flexural Modulus - 30 to 32 Gpa

Technical Documents
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